Dicing Blades with The Diamond

TOKYO SEIMITSU CO., LTD.

The outstanding product development capacity of TOKYO SEIMITSU CO., LTD. supports various problems that occur during the cutting or grinding processes of electronics parts or semiconductors.

The slicing blade realizes high-precision and high throughput in the cutting processes of packages, glass epoxy substrates, and highly brittle materials, as does the hub dicing blade in cutting silicon, compound semiconductors, or sapphire devices, etc.

The BG wheel realizes precision increases and stress reduction for the back side of wafers, and the CMP conditioner provides excellent conditioning performance through unique technologies.