
ERS Co., Ltd.
Electronics Semiconductors Related Devices manufactured by JCM Corporation are customized based on the sincere consideration of detailed customer requests. If there are any requests, please feel free to let us know.
- Peripheral devices for dicing and back-grinding, such as tape mounters
- Forming test equipment such as embossed tapes and probers
- Peripheral devices for die bonding such as frame cutters
- Equipment related to wafer processing such as wafer heatup devices
- Other various forms of custom equipment, etc.
Electronics Parts and Equipment : Advanced Components Division
Phone : 81-3-5200-8102
Fax : 81-3-5200-8133